http://mam2018.mdm.imm.cnr.it
Milano, March 18-21 2018
MAM 2018 will be the 27th in a series of conferences devoted to research on materials and processes for back and front end of the line, including interconnect and silicide materials. Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards materials for advanced metallization in 1995, the 2018 conference also aims to address new challenges in the fields of materials for stretchable and bendable electronics, micro-electro-mechanical systems, emerging nanoscale devices as well as process and device modelling and simulation.
The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications. It is dedicated to international material scientists, process and integration engineers and students,
Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.
Location
This year’s conference will be held in Milano, Italy, the world famous capital of fashion that combines history, art, culture, architecture and culinary excellence.
Key dates
Abstracts due: December 17th 2017
(Abstracts: 2 pages including figures to be submitted to https://mam2018.mdm.imm.cnr.it)
Paper acceptance: January 20th 2018
Early registration deadline: February 20th 2018
Submission of full length papers: April 15th 2018
(Full length papers will be published in a special issue of Microelectronic Engineering)
Contacts:
mam2018.mdm.imm.cnr.it
E-mail: mam2018@mdm.imm.cnr.it
Phone:+39 0396032885
