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Block copolymer (BCP) self-assembly is expected to complement conventional optical lithography for the fabrication of next-generation microelectronic devices. In this regard, silicon-containing BCPs with a high Flory–Huggins interaction parameter (χ) are extremely appealing because they form high-resolution nanostructures with characteristic dimensions below 10 nm. However, due to their slow self-assembly kinetics and low thermal stability, these silicon-containing high-χ BCPs are usually processed by solvent vapor annealing or in solvent-rich ambient at a low annealing temperature, significantly increasing the complexity of the facilities and of the procedures. In this work, the self-assembly of cylinder-forming polystyrene-block-poly(dimethylsiloxane-random-vinylmethylsiloxane) (PS-b-P(DMS-r-VMS)) BCP on flat substrates is promoted by means of a simple thermal treatment at high temperatures …
American Chemical Society
Publication date: 
20 Apr 2016

Tommaso Jacopo Giammaria, Federico Ferrarese Lupi, Gabriele Seguini, Michele Perego, Francesco Vita, Oriano Francescangeli, Brandon Wenning, Christopher K Ober, Katia Sparnacci, Diego Antonioli, Valentina Gianotti, Michele Laus

Biblio References: 
Volume: 8 Issue: 15 Pages: 9897-9908
ACS applied materials & interfaces